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Top Side Probing
Minimize solder joint stress and board bending with Precitronic’s precision overclamps and component-relief milling technology.
Top-Side Probing & Zero-Flex Plates for High-Density PCBs
Modern high-density, double-sided PCBs require advanced testing methods to protect sensitive solder joints and components. Precitronic integrates Top-Side Probing (TSP) and Zero-Flex (ZF) technologies into our ICT and Functional test fixtures to eliminate board bending and minimize mechanical stress.
Precision Top-Side Probing (TSP)
Overcoming the size and alignment challenges of double-sided testing:
- Micro-Probing Accuracy: Safely hit test points from the top side using standard 50 mil probes.
- Guided Mechanical Overclamps: Our fixture kits feature precision-guided top covers that ensure smooth, perfectly aligned contact every time.
- Solder Joint Protection: Significantly reduces the risk of micro-fractures on surface-mount components.
Zero-Flex (ZF) Technology
Traditional push-fingers and pressure pins can cause severe board flex. Zero-Flex replaces them with a custom-engineered solution:
- Finger-Free Design: Eliminates standard PCB pushers and push fingers entirely.
- Component-Relief Milling: The top plate is professionally routed to mirror the heights of your PCB components, ensuring no components are crushed or damaged.
- Zero-Component Push Areas: Pressure is applied exclusively to flat, open areas of the bare board where no components are present.
Unmatched Stress Reduction Limits
Excessive board bending during testing leads to field failures. Precitronic fixtures ensure your boards stay flat and safe:
- Standard Fixtures: Easily achieve under 400 microstrain limits.
- Zero-Flex Upgrades: Drop stress levels to an ultra-low under 200 microstrain threshold.